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Organizers
Conference Co-Chairs:
Vedran Bilas, University of Zagreb, Croatia
Alessandra Flammini, Università degli Studi di Brescia, Italy
Technical Program Co-Chairs:
Deniz Gurkan, University of Houston, USA
Salvatore Baglio, University of Catania, Italy
SAS Steering Committee:
Salvatore Baglio, University of Catania, Italy
Vedran Bilas, University of Zagreb, Croatia
Alessandra Flammini, Università degli Studi di Brescia, Italy
Deniz Gurkan, University of Houston, USA
Gourab Sen Gupta, Massey University, New Zealand
Conference Management:
Conference Catalysts, LLC
(Lauren Pasquarelli, [email protected])
Technical Committee:
Ahmed Abdelgawad, Central Michigan University, USA
Mohd Abdullah, Universiti Sains Malaysia, Malaysia
Rini Akmeliawati, International Islamic University, Malaysia
Abdulaziz Alsayyari, Shaqra University, Saudi Arabia
Davorin Ambruš, University of Zagreb, Croatia
Bruno Andò, University of Catania, Italy
Christoph Baer, Ruhr-Universität Bochum, Germany
René Bergelt, TU Chemnitz, Germany
Stephan Blokzyl, Technische Universitaet Chemnitz, Germany
Hang Bui Thu, University of Engineering and Technology, VNU-H, Vietnam
Norlida Buniyamin, Universiti Teknologi MARA, Malaysia
Daniel Burmester, Victoria University of Wellington, New Zealand
Justin Cappos, New York University, USA
Paskorn Champrasert, Chiang Mai University, Thailand
Ben-Jye Chang, National Yunlin University of Science and Technology, Taiwan
Amitava Chatterjee, University Kolkata, India
Gaurav Chaudhary, Birla Institute of Technology and Science, Pilani, UAE
Zhen Chen, The University of Queensland, Australia
Trinh Chu Duc, VNU University of Engineering and Technology, Vietnam
Damiano Crescini, University of Brescia, Italy
Tamás Dabóczi, Budapest University of Technology and Economics, Hungary
Mohd Abdullah, Universiti Sains Malaysia, Malaysia
Rini Akmeliawati, International Islamic University, Malaysia
Abdulaziz Alsayyari, Shaqra University, Saudi Arabia
Davorin Ambruš, University of Zagreb, Croatia
Bruno Andò, University of Catania, Italy
Christoph Baer, Ruhr-Universität Bochum, Germany
René Bergelt, TU Chemnitz, Germany
Stephan Blokzyl, Technische Universitaet Chemnitz, Germany
Hang Bui Thu, University of Engineering and Technology, VNU-H, Vietnam
Norlida Buniyamin, Universiti Teknologi MARA, Malaysia
Daniel Burmester, Victoria University of Wellington, New Zealand
Justin Cappos, New York University, USA
Paskorn Champrasert, Chiang Mai University, Thailand
Ben-Jye Chang, National Yunlin University of Science and Technology, Taiwan
Amitava Chatterjee, University Kolkata, India
Gaurav Chaudhary, Birla Institute of Technology and Science, Pilani, UAE
Zhen Chen, The University of Queensland, Australia
Trinh Chu Duc, VNU University of Engineering and Technology, Vietnam
Damiano Crescini, University of Brescia, Italy
Tamás Dabóczi, Budapest University of Technology and Economics, Hungary
Anand Daga, Dell, USA
Frank Daschner, University of Kiel, Germany
Chiara Maria De Dominicis, University of Brescia, Italy
Serge Demidenko, RMIT International University Vietnam, Vietnam
John Dennis, Universiti Teknologi PETRONAS, Malaysia
Alessandro Depari, University of Brescia, Italy
Robin Dykstra, Victoria University of Wellington, New Zealand
Hrvoje Džapo, University of Zagreb, Croatia
Frank Daschner, University of Kiel, Germany
Chiara Maria De Dominicis, University of Brescia, Italy
Serge Demidenko, RMIT International University Vietnam, Vietnam
John Dennis, Universiti Teknologi PETRONAS, Malaysia
Alessandro Depari, University of Brescia, Italy
Robin Dykstra, Victoria University of Wellington, New Zealand
Hrvoje Džapo, University of Zagreb, Croatia
Ante Elez, KONČAR, Croatia
Farshid Entessari, Sharif University, International Campus, Faculty of Engineering, Iran
Halit Eren, Curtin University of Technology, Australia
Junliang Fan, The University of Queensland, Australia
Georg Fischer, University of Erlangen-Nuremberg, Germany
Ada Fort, University of Siena, Italy
Maryam Ghahramani, University of Wollongong, Australia
Alireza Gheitasi, Waikato Institute of Technology, New Zealand
Xiang Gui, Massey University, New Zealand
Jinhong-Richie Guo, Nanyang Technological University, Singapore
Farshid Entessari, Sharif University, International Campus, Faculty of Engineering, Iran
Halit Eren, Curtin University of Technology, Australia
Junliang Fan, The University of Queensland, Australia
Georg Fischer, University of Erlangen-Nuremberg, Germany
Ada Fort, University of Siena, Italy
Maryam Ghahramani, University of Wollongong, Australia
Alireza Gheitasi, Waikato Institute of Technology, New Zealand
Xiang Gui, Massey University, New Zealand
Jinhong-Richie Guo, Nanyang Technological University, Singapore
Nick Harris, University of Southampton, UK
Yusuke Hioka, University of Auckland, New Zealand
Michael Hofbauer, Vienna University of Technology, Austria
Gwo-Jiun Horng, Fortune Institute of Technology, Taiwan
Chun-Ming Huang, National Chip Implementation Center, Taiwan
Eeunjae Hyun, Seoul National University, Korea
Timo Jaeschke, Ruhr-University Bochum, Germany
Bhushan Jagyasi, TCS Innovation Labs Mumbai, India
Yongwoo Jeong, Samsung S1 Corporation, Korea
Chari Kandala, USDA, USA
Yusuke Hioka, University of Auckland, New Zealand
Michael Hofbauer, Vienna University of Technology, Austria
Gwo-Jiun Horng, Fortune Institute of Technology, Taiwan
Chun-Ming Huang, National Chip Implementation Center, Taiwan
Eeunjae Hyun, Seoul National University, Korea
Timo Jaeschke, Ruhr-University Bochum, Germany
Bhushan Jagyasi, TCS Innovation Labs Mumbai, India
Yongwoo Jeong, Samsung S1 Corporation, Korea
Chari Kandala, USDA, USA
Eugenijus Kaniusas, Vienna University of Technology, Austria
Donghan Kim, Kyung Hee University, Korea
Tae il Kim, Sungkyunkwan University (SKKU), Korea
Dietmar Kissinger, University of Erlangen-Nuremberg, Germany
Govindarajan Konda Naganathan, University of Nebraska Lincoln, USA
Jürgen Kosel, King Abdullah University of Science and Technology, Saudi Arabia
Anton Kruger, University of Iowa, USA
Ye Chow Kuang, Monash University Malaysia, Malaysia
Hardeep Kumar, Birla Institute of Technology & Science, Dubai, UAE
Venkata Kuncham, CVR COLLEGE OF ENGG, India
Chih-Ting Kuo, National Chip Implementation Center, Taiwan
Jacques Kvam, Sandia National Laboratories, USA
Michele Magno, Swiss Federal Institute of Technology (ETH), Zurich, Switzerland
Donghan Kim, Kyung Hee University, Korea
Tae il Kim, Sungkyunkwan University (SKKU), Korea
Dietmar Kissinger, University of Erlangen-Nuremberg, Germany
Govindarajan Konda Naganathan, University of Nebraska Lincoln, USA
Jürgen Kosel, King Abdullah University of Science and Technology, Saudi Arabia
Anton Kruger, University of Iowa, USA
Ye Chow Kuang, Monash University Malaysia, Malaysia
Hardeep Kumar, Birla Institute of Technology & Science, Dubai, UAE
Venkata Kuncham, CVR COLLEGE OF ENGG, India
Chih-Ting Kuo, National Chip Implementation Center, Taiwan
Jacques Kvam, Sandia National Laboratories, USA
Michele Magno, Swiss Federal Institute of Technology (ETH), Zurich, Switzerland
Nguyen Ngoc Mai-Khanh, University of Tokyo, Japan
Vincenzo Marletta, University of Catania, Italy
Lifford McLauchlan, Texas A&M University-Kingsville, USA
Lifford McLauchlan, Texas A&M University-Kingsville, USA
Geoff Merrett, University of Southampton, UK
Byung-Cheol Min, Carnegie Mellon University, USA
Byung-Cheol Min, Carnegie Mellon University, USA
Nikola Mišković, University of Zagreb, Croatia
Marco Mugnaini, University of Siena, Italy
Fangling Pu, School of Electronic Information, Wuhan University, P.R. China
Konstantinos Rantos, Eastern Macedonia and Thrace Institute of Technology, Greece
Emilio Sardini, University of Brescia, Italy
John Schmalzel, NASA Stennis, USA
Mauro Serpelloni, University of Brescia, Italy
Akash Singh, IBM, USA
Emiliano Sisinni, University of Brescia, Italy
Marco Mugnaini, University of Siena, Italy
Fangling Pu, School of Electronic Information, Wuhan University, P.R. China
Konstantinos Rantos, Eastern Macedonia and Thrace Institute of Technology, Greece
Emilio Sardini, University of Brescia, Italy
John Schmalzel, NASA Stennis, USA
Mauro Serpelloni, University of Brescia, Italy
Akash Singh, IBM, USA
Emiliano Sisinni, University of Brescia, Italy
Qingquan Sun, Oakland University, USA
Carlo Trigona, University of Catania, Italy
Michele Vadursi, University of Naples Parthenope, Italy
Darko Vasić, University of Zagreb, Croatia
Valerio Vignoli, University of Siena, Italy
Matthias Vodel, Chemnitz University of Technology, Germany
Qiao Xiang, McGill University, Canada
Wuliang Yin, University of Manchester, United Kingdom
Sergey Yurish, Universitat Politecnica de Catalunya (UPC), Spain
Carlo Trigona, University of Catania, Italy
Michele Vadursi, University of Naples Parthenope, Italy
Darko Vasić, University of Zagreb, Croatia
Valerio Vignoli, University of Siena, Italy
Matthias Vodel, Chemnitz University of Technology, Germany
Qiao Xiang, McGill University, Canada
Wuliang Yin, University of Manchester, United Kingdom
Sergey Yurish, Universitat Politecnica de Catalunya (UPC), Spain
Hubert Zangl, Alpen-Adria Universität Klagenfur, Austria